bayerworld233-svg / wlp-warpage-explorer Star 0 Code Issues Pull requests Analytical warpage & thermo-mechanical stress toolkit for wafer-level packaging (WLP): Stoney / Timoshenko / N-layer laminate models, interactive Streamlit dashboard, validated against classical closed-form results. thermomechanical warpage wafer-level-packaging semiconductor-packaging ic-packaging Updated Aug 8, 2026 Python
aaronukgarcia / 33-Pico-Scale-Welding Star 0 Code Issues Pull requests research white-paper advanced-manufacturing nanoscale semiconductor nanofabrication phonon-transport electrospray precision-engineering wafer-level-packaging Updated Jan 5, 2026