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9 changes: 1 addition & 8 deletions zh-cn/contest_2026/hardware_porting/supported_hardware.md
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- **技术资料**:[LogicPi A1 开发板资料.zip](../attachment/LogicPi%20A1%20开发板资料.zip)
- **上游目标仓(获奖后 PR)**:`vendor_amlogic`(仓库 / 大赛分支待创建,`boards/` 目录)

### 6、RK3588 开发板 — 瑞芯微(适配中)

- **芯片特点**:高性能多核 SoC(详见数据手册)
- **状态**:适配进行中。
- **技术资料**:[RK3588 开发板资料.zip](../attachment/RK3588%20开发板资料.zip) | [百度网盘(提取码 gff2)](https://pan.baidu.com/s/1GxmBTRQScAm-h79onpWidA?pwd=gff2)
- **上游目标仓(获奖后 PR)**:`vendor_rockchip`(`dev-ai-contest-2026` 分支,`boards/` 目录)

### 7、KICKPI-K7(RK3576)— 瑞芯微
### 6、KICKPI-K7(RK3576)— 瑞芯微

- **芯片特点**:Rockchip RK3576 高性能多核 SoC(含 NPU,详见官方硬件资料)
- **适用场景**:边缘 AI、多媒体网关、工业控制、嵌入式学习
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