ESP32-S3-LCD-1.47 Enclosure (ESP-STICK)

A compact enclosure and firmware workspace for the Waveshare ESP32-S3-LCD-1.47 development board.

The project currently contains the mechanical STEP model for the ESP-STICK enclosure, reference resources, and a baseline firmware sketch for the SerialSIM device.

Product reference: https://www.waveshare.com/wiki/ESP32-S3-LCD-1.47

Project Status

• Hardware: enclosure STEP files are organized under hardware/step/.
• Printable STL exports are organized under hardware/stl/.
• Firmware: the current Arduino sketch is under firmware/SerialSIM/.

Features

• Designed around the Waveshare ESP32-S3-LCD-1.47 board.
• Two-part enclosure model with top and bottom shells.
• Assembly STEP file for reviewing the full device.
• Firmware workspace for serial, TCP, and protocol-simulation work.
• Device notes for the SerialSIM target.

Bill of Materials

Item	Qty	Part / File	Notes
ESP32-S3-LCD-1.47 development board	1	Waveshare ESP32-S3-LCD-1.47	Target board for the enclosure and firmware.
Enclosure top	1	ESP-STICK-ENCLOSURE-TOP.stl	Printable top shell.
Enclosure bottom	1	ESP-STICK-ENCLOSURE-BOTTOM.stl	Printable bottom shell.
EDDM-M2-L4 screw	4	JLCMC EDDM-M2-L4	Mounting hardware for the enclosure assembly.
ELSV-S1W-M1.4-L8-S2.5 screw	4	JLCMC ELSV-S1W-M1.4-L8-S2.5	Mounting hardware for the enclosure assembly.

Repository Structure

.
├── firmware/
│   ├── README.md
│   └── SerialSIM/
│       ├── DeviceDetails.md
│       └── SerialSIM.ino
├── hardware/
│   ├── README.md
│   ├── assy-bottom.png
│   ├── assy-exploded.png
│   ├── assy-top.png
│   ├── step/
│   │   ├── ESP-STICK-ASSEMBLY.step
│   │   ├── ESP-STICK-ENCLOSURE-BOTTOM.step
│   │   └── ESP-STICK-ENCLOSURE-TOP.step
│   └── stl/
│       ├── ESP-STICK-ENCLOSURE-BOTTOM.stl
│       └── ESP-STICK-ENCLOSURE-TOP.stl
└── README.md

Hardware

Mechanical source files are stored in hardware/step/, and printable STL exports are stored in hardware/stl/.

• ESP-STICK-ASSEMBLY.step is the full assembly.
• ESP-STICK-ENCLOSURE-TOP.step and ESP-STICK-ENCLOSURE-BOTTOM.step are the enclosure shells.
• ESP-STICK-ENCLOSURE-TOP.stl and ESP-STICK-ENCLOSURE-BOTTOM.stl are the current printable exports.

Export to other printer-ready formats from the STEP models as needed. Keep those exports under a dedicated hardware subfolder such as hardware/stl/ or hardware/3mf/.

Current STL exports are tracked, but slicer settings and orientation should be reviewed before printing.

Printing Recommendations

For the cleanest appearance, resin printing is the preferred process for this enclosure. SLA/MSLA resin prints can produce sharper edges, smoother surfaces, and less visible layer texture than FDM, which should suit the small screen opening and compact handheld form factor well.

Use a tough, ABS-like, or engineering resin rather than a standard brittle resin if the enclosure will be handled often, screwed together repeatedly, or carried loose in a bag. FDM in PETG or ABS is still a good option for rough prototypes, heat exposure, or parts where impact resistance matters more than surface finish.

Resin prints should be washed and post-cured according to the resin manufacturer's guidance. Avoid over-curing, since some resins can become more brittle with excessive UV exposure.

Firmware

Firmware lives in firmware/. The current sketch is:

firmware/SerialSIM/SerialSIM.ino

The SerialSIM notes describe the target device, current scope, and intended future behavior. See firmware/SerialSIM/DeviceDetails.md.

Contributions

Contributions, improvements, and remixes are welcome.