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6 tasks
- Fix calculation of pad width (applying 2*side from IPC density level). - Fix wrong package length & lead width for EIAJ & JEDEC packages. - Use nominal lead widths for all packages, fixing inconsistent usage of maximum vs. nominal value. - Update to density level values for toe/heel/side of the latest Footprint Expert guidelines (pcblibraries.com), which are now split into many different values depending on the pitch. - Update to latest JEDEC standards. - Improve silkscreen drawing (now 'U'-shaped at top/bottom instead of just a single straight line). - Improve package outline / courtyard polygons (now following the shape of the leads instead of just one big rectangle). - Reduce line width from 0.25 to 0.2mm according our library guidelines. - Reduce space between NAME/VALUE labels and package body. - Unify description, now consistent for all variants of SO packages.
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Heavy refactoring of all SO packages:
Example:
Library PR: LibrePCB-Libraries/LibrePCB_Base.lplib#196