The December 2024 run is out of the fab, so you can now ask for samples.
- Sign the Hiring Agreement: samples.rtf (download i
- Send the signed file by email to:
- herman(at)ihp-microelectronics.com
- nkehder(at)ihp-microelectronics.com
Please include all contact details:
- Name Last Name
- Address
- Phone number
- By default, we send 10 bare dies.
- If you need a packaged chip, we can offer QFN or open QFN with pin counts from 24 to 64.
- For bonding, we need a bonding plan.
| Design name | Short one line description | Location directory |
|---|---|---|
Three SiGe HBT amplifiers (FMD_QNC_amps_filled) |
Three SiGe HBT low-power amplifiers, a 3.3 V shunt regulator, and RF test structures on IHP SG13G2. | RF_amplifiers/ |